DEMİRKIR, C. Et Al. 2016. Influence of Aging Procedure on Bonding Strength and Thermal Conductivity of Plywood Panels. ACTA PHYSICA POLONICA A , vol.129, no.6 , 1230-1234.

DEMİRKIR, C., ÇOLAKOĞLU, G., ÇOLAK, S., AYDIN, İ., & Candan, Z., (2016). Influence of Aging Procedure on Bonding Strength and Thermal Conductivity of Plywood Panels. ACTA PHYSICA POLONICA A , vol.129, no.6, 1230-1234.

DEMİRKIR, CENK Et Al. "Influence of Aging Procedure on Bonding Strength and Thermal Conductivity of Plywood Panels," ACTA PHYSICA POLONICA A , vol.129, no.6, 1230-1234, 2016

DEMİRKIR, CENK Et Al. "Influence of Aging Procedure on Bonding Strength and Thermal Conductivity of Plywood Panels." ACTA PHYSICA POLONICA A , vol.129, no.6, pp.1230-1234, 2016

DEMİRKIR, C. Et Al. (2016) . "Influence of Aging Procedure on Bonding Strength and Thermal Conductivity of Plywood Panels." ACTA PHYSICA POLONICA A , vol.129, no.6, pp.1230-1234.

@article{article, author={CENK DEMİRKIR Et Al. }, title={Influence of Aging Procedure on Bonding Strength and Thermal Conductivity of Plywood Panels}, journal={ACTA PHYSICA POLONICA A}, year=2016, pages={1230-1234} }