Fabrication and characterization of novel layered materials produced by electroless plating and hot pressing

Güler O., Alver Ü., Varol T.

JOURNAL OF ALLOYS AND COMPOUNDS, cilt.835, 2020 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 835
  • Basım Tarihi: 2020
  • Doi Numarası: 10.1016/j.jallcom.2020.155278
  • Dergi Adı: JOURNAL OF ALLOYS AND COMPOUNDS
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Academic Search Premier, PASCAL, Aerospace Database, Chimica, Communication Abstracts, Compendex, INSPEC, Metadex, Public Affairs Index, Civil Engineering Abstracts
  • Anahtar Kelimeler: FGMs, Electroless plating, Layered metallic powders, Hot pressing, Powder metallurgy, FLAKE POWDER-METALLURGY, MECHANICAL-PROPERTIES, COPPER PARTICLES, MATRIX COMPOSITE, COATED COPPER, MICROSTRUCTURE, SILVER, TEMPERATURE, DEPOSITION, COATINGS
  • Karadeniz Teknik Üniversitesi Adresli: Evet

Özet

In this study, two types of three-layer functional graded materials (FGMs) were produced by hot pressing method. For the fabrication of the FGMs, electroless silver coated copper powders with flake-like morphology were used in the first layer on the spherical copper core layer. For the fabrication of Cu -Ag-Cr samples, surface of the electroless silver coated copper powders was coated with chrome. On the other hand, for synthesize of Cu-Ag-Ni compacts, the surface of the electroless silver coated copper powders was coated with nickel. The hardness and electrical conductivity of the Cu core and Cu-Ag samples were approximately 82 HB, 95% IACS and 100 HB, 100% IACS, respectively. The hardness and electrical conductivity of the Ni layer in the Cu-Ag-Ni samples were 125 HB and 76% IACS, while that of Cr layer had 115 HB and 75% IACS in the Cu-Ag-Cr compacts. It was determined that the materials fabricated by using layered metallic powders provide both high conductivity and good oxidation resistance. Results show that the oxidation resistance of Cu-Ag-Cr and Cu-Ag-Ni materials was about 20 times higher than that of conventional copper materials. (C) 2020 Elsevier B.V. All rights reserved.