In this study, the electroless silver plating method was applied on the copper particles synthesized by mechanical milling process. The plating process was carried out at the temperature of 60 degrees C, at the pH of 11 and the stirring speed of 600 rpm to obtain uniform silver coating on the copper particles. SEM results showed that milling time has important effects on the coating thickness and surface morphology of silver coated copper particles. The specific surface area (SSA) of silver coated copper particles changes due to flake-like morphology obtained by mechanical milling. It was determined that the coating thickness not only depends on the parameters of electroless silver plating process but also depends on the morphology of the copper particles. Accordingly, the best bonding between silver layer and copper particles was observed in silver-plated copper particles milled for 120 min. The silver coating thickness of silver-plated copper particles milled for 120 min was about 2 mu m. It was found that the change in weight of milled copper particles for 120 min was only 1.5 wt% at 500 degrees C of thermal oxidation test. This value was about one-sixth of the increase of weight that occurred after oxidation for the unmilled copper particles having the silver coating in size of 5 mu m. (C) 2018 Elsevier B.V. All rights reserved.