Akademik Veri Yönetim Sistemi
The International Conference of Materials and Engineering Technology (TICMET'25), Gaziantep, Türkiye, 6 - 08 Ekim 2025, ss.0-1, (Tam Metin Bildiri)
The rapid increase in power densities of modern
electronic devices necessitates efficient thermal management. Phase change
materials (PCMs) are promising due to their latent heat storage capacity, yet
their low thermal conductivity limits performance. To address this, an Al6063
open-cell metal foam with 6 mm pore size was fabricated by selective laser
melting (SLM) and combined with RT-42 PCM to form a composite cooling system.
The system was experimentally tested under constant heat loads of 25 W and 35 W
and initial temperatures of 20, 25, and 30 °C, and compared against a pure PCM
configuration. Temperature was monitored using thermocouples embedded in the
foam volume and at the base surface, with the critical limit set to 80 °C (tg).
At 25 W, the composite extended safe operation time, with tg increasing from
1395 s at 30 °C to 1758 s at 20 °C (~26% improvement). At 35 W, tg values were
shorter overall (868–1022 s), reflecting ~40% reduction compared to 25 W, but
lowering the initial temperature still provided ~18% improvement. Comparisons
with pure PCM confirmed the critical role of the metallic foam: at 35 W pure
PCM reached the critical temperature within 85 s, while the composite lasted
963 s, nearly 10 times longer. Internal measurements revealed vertical
stratification, with the bottom heating fastest, the middle showing the
strongest latent heat buffering, and the top reflecting delayed convective
contributions. Overall, results demonstrate that metal foam integration
enhances PCM utilization, prolongs safe operation by up to an order of
magnitude compared to pure PCM, and that lower operating temperatures further
improve reliability, highlighting the potential of foam–PCM composites for
passive electronic cooling.