An effective method for the frictional thermoelastic contact of a cylindrical punch on a piezoelectric layer


JOURNAL OF THERMAL STRESSES, vol.44, no.8, pp.1030-1051, 2021 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 44 Issue: 8
  • Publication Date: 2021
  • Doi Number: 10.1080/01495739.2021.1937419
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Academic Search Premier, Aerospace Database, Communication Abstracts, Compendex, INSPEC, Metadex, Civil Engineering Abstracts
  • Page Numbers: pp.1030-1051
  • Keywords: Contact mechanics, Fourier integral transform, friction, heat flux, piezoelectric materials, singular integral equations, thermoelasticity, FUNCTIONALLY GRADED MATERIALS, HALF-PLANE, MOVING CONTACT, RIGID PUNCH, FLAT PUNCH, MECHANICS, BEHAVIOR
  • Karadeniz Technical University Affiliated: Yes


In this study, the plane steady state thermoelastic frictional contact problem between a rigid cylindrical punch and a homogenous piezoelectric layer bonded to the rigid base is considered. The punch is assumed to be a perfect electric conductor and thermal insulator and slides over the piezoelectric layer with a small constant speed and heat flux is generated due to the friction. The general stress, displacement, and electrical expressions for the thermoelastic piezoelectric contact problem are derived using the theory of thermoelasticity and Fourier integral transform technique. Applying the boundary conditions, the present problem is reduced to Cauchy-type singular integral equations of the second kind in which the contact stress, the electrical displacement, and the contact width are unknown. The singular integral equations are solved numerically using Gauss-Jacobi and Gauss-Chebyshev integration formula with a developed effective method. The effect of moving velocity, friction coefficient, external load, electric charge, punch radius, and layer height on the contact stress, in-plane stress, electric displacement, and generated temperature are discussed in detail. This work is the first study that investigates a cylindrical punch on a thermoelastic contact of a piezoelectric layer.