Effects of TiO2 and Al2O3 nanoparticles addition on the thermal properties and wettability of Sn-3.0Ag-0.5Cu-xTiO2-xAl2O3

Muzni N. H. M., Noor E. E. M., Abdullah M. M. A., AKSOY C.

International Conference on Electronic and Advanced Materials 2021, ICEAM 2021, Virtual, Online, 02 November 2021, vol.2169 identifier

  • Publication Type: Conference Paper / Full Text
  • Volume: 2169
  • Doi Number: 10.1088/1742-6596/2169/1/012003
  • City: Virtual, Online
  • Karadeniz Technical University Affiliated: Yes


© Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence.This study investigated the effects of adding titanium dioxide (TiO2) and aluminium oxide (Al2O3) nanoparticles into Sn3.0Ag0.5Cu (SAC) lead-free solder alloy on the thermal properties and wettability. In comparison with SAC lead-free solder without addition of nanoparticles, the melting temperature is very similar and comparable. The solidus temperature is in the range of 217.1 to 217.2 °C with the addition of TiO2 and Al2O3 nanoparticles. The results shows that the addition of 0.25-1.0 wt% of TiO2 and Al2O3 nanoparticles caused the liquidus temperature to decrease from 222.4 to 220.5 °C. The spreading area of SAC-xTiO2-xAl2O3 lead-free solder increases from 5.7 to 7.1mm at 0-0.5wt% of TiO2 and Al2O3 nanoparticles. The contact angle decreased from 66.09 to 46.84 when the composition of TiO2 and Al2O3 increases from 0-0.5wt%.