This study explores the possibility of using wood exposed to insect and fungi degradation for the particleboard industry. For this purpose, some physical and mechanical properties of particleboard produced with Pinus sylvestries L. wood degraded by insect (Ips sexdentatus Boerner) and then fungi (Fomes fomentarius) were determined. The results showed that the insect degradation did not significantly change the amount of cellulose, hemicelluloses and lignin, while insect + fungi degradation decreased these values. The degradation of wood by insect or insect + fungi significantly improved the physical properties and formaldehyde emission. On the other hand, the degradation of wood by insect or insect + fungi negatively influenced the surface quality and mechanical strength properties of particleboard. The use of degraded wood particles by 10 wt% was not found to be effective on the particleboard properties. The increment in the amount of degraded wood particles above 10 wt% negatively influenced the strength and surface quality properties, while the water absorption/thickness swelling and formaldehyde emission decreased.