Akademik Veri Yönetim Sistemi
5th International Conference on Quality, Reliability and Maintenance, Oxford, Birleşik Krallık, 1 - 02 Nisan 2004, ss.31-34
The objective of this study is to investigate the use of kenaf (Hibuscus cannabinus L.) to manufacture experimental particleboard panels. Nine three-layer panels with an average density levels of 0.50 g/cm(3), 0.60 g/cm(3),0.70 g/cm(3) and three shelling ratios were manufactured. The panels were tested for mechanical strength and dimensional properties according to European Standards. The results showed that overall bending strength and internal bond strength of the specimens were higher than those of other panels made from different agricultural residues. The panels with 0.70 g/cm3 density had the highest modulus of rupture (MOR). Dimensional stability of the specimens were low as compared to that of typical particleboard. Based on the findings in this study, it appears that kenaf can be used to manufacture particleboard without having any adverse influence on the panel properties.