Influence of a polycarboxylate based solution on stability of hydrogen peroxide and application to e-waste leaching


YAZICI E. Y.

Acta Metallurgica Slovaca, cilt.26, sa.1, ss.17-23, 2020 (ESCI) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 26 Sayı: 1
  • Basım Tarihi: 2020
  • Doi Numarası: 10.36547/ams.26.1.330
  • Dergi Adı: Acta Metallurgica Slovaca
  • Derginin Tarandığı İndeksler: Emerging Sources Citation Index (ESCI), Scopus, Directory of Open Access Journals
  • Sayfa Sayıları: ss.17-23
  • Karadeniz Teknik Üniversitesi Adresli: Evet

Özet

© 2020, Technical University of Kosice. All rights reserved.Hydrogen peroxide with its high oxidising potential is commonly used in hydrometallurgical extraction of metals from ores, anode slimes and waste materials (e.g. WEEE) and treatment of cyanidation effluents. Main detraction to H2O2 is its rapid catalytic decomposition leading to prohibitively high consumption. Effect of pH (0-4), Cu(II) (0-10 g.l-1) and temperature (20-80°C) on H2O2 stability was investigated using response surface methodology. Influence of neutral-alkaline conditions (pH 7.3-11.8) and presence of solids (1-20% w/v) was also tested. A polycarboxylate based solution (PBS) was utilised to improve H2O2 stabilisation. The significance order of parameters on H2O2 decomposition was temperature > pH > Cu(II). Elevating the level of these parameters increased H2O2 decomposition. The activation energy (60.7±2.5 kJ.mol-1) indicated a chemically controlled process. Alkaline conditions (up to pH 11.8) led to higher H2O2 decomposition. Presence of solids adversely affected H2O2 stability under certain conditions. The addition of PBS significantly improved (up to 54%) H2O2 stability in the presence of copper. The presence of PBS in H2SO4-H2O2 leaching of waste of printed circuit boards (WPCBs) provided a limited enhancement in copper extraction by up to 19%. PBS can be suitably utilised to stabilise and hence reduce H2O2 consumption in aqueous solutions particularly in the presence of copper.