Effects of Composition and Processing on the Properties of Sn-3Zn-4Bi and Sn-Ag-Cu Solder Alloys for Electronic Packaging

Soosai T., Noor E. E. M. N., Baig M. F., AKSOY C.

International Journal on Robotics, Automation and Sciences, vol.7, 2025 (Peer-Reviewed Journal)

• Publication Type: Article / Article
• Volume: 7
• Publication Date: 2025
• Doi Number: 10.33093/ijoras.2025.7.3.1
• Journal Name: International Journal on Robotics, Automation and Sciences
• Karadeniz Technical University Affiliated: Yes