The effect of matrix morphology and Cu-coated SiC content on the mechanical and electrical properties of novel Cu–SiC composites
Scientific Reports, cilt.16, sa.1, 2026 (SCI-Expanded, Scopus)
- Yayın Türü: Makale / Tam Makale
- Cilt numarası: 16 Sayı: 1
- Basım Tarihi: 2026
- Doi Numarası: 10.1038/s41598-026-60041-8
- Dergi Adı: Scientific Reports
- Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, BIOSIS, Chemical Abstracts Core, EMBASE, MEDLINE, Directory of Open Access Journals, Zoological Record, Academic Search Ultimate (EBSCO), Natural Science Collection (ProQuest), Biological Science Database (ProQuest), Biomedical Reference Collection: Corporate Edition (EBSCO), Health Research Premium Collection (ProQuest)
- Anahtar Kelimeler: Copper matrix composites, Electroless Cu-coated SiC, Flake and dendritic copper powders, Matrix morphology
- Karadeniz Teknik Üniversitesi Adresli: Evet
Özet
In this study, the effects of Cu matrix morphology and Cu-coated SiC reinforcement ratio on the microstructure, mechanical, and electrical properties of Cu-SiC composites were investigated. Dendritic and flake morphologies were used as Cu matrix morphologies, while Cu-coated SiC particle ratios were selected as 5, 10, and 20% by volume. FESEM/EDS and XRD analyses confirmed that the surface of the SiC particles was homogeneously coated with Cu. This strategy was taken to enhance the matrix-reinforcement interface and achieve a more compact composite. Results show that matrix morphology is an important factor in the performance of the composites. Composites of flake Cu matrix have demonstrated increased relative density (90.96 vs. 87.82%), hardness (~ 135 vs. ~110 HB), tensile strength (~ 252 vs. 177 MPa), and electrical conductivity (88% IACS vs. 75% IACS) compared to composites of dendritic Cu matrix. The flake Cu matrix composite containing 10 vol% Cu-coated SiC reinforcement showed the most stable performance in terms of mechanical and electrical properties. In this context, this composite was shown to be a scalable and high-performance material candidate for the field of electrical materials.