Enhancement of electrical and thermal conductivity of low-cost novel Cu–Ag alloys prepared by hot-pressing and electroless plating from recycled electrolytic copper powders

VAROL T., GÜLER O., AKÇAY S. B., Çuvalcı O.

Materials Chemistry and Physics, cilt.281, 2022 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 281
  • Basım Tarihi: 2022
  • Doi Numarası: 10.1016/j.matchemphys.2022.125892
  • Dergi Adı: Materials Chemistry and Physics
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Academic Search Premier, Aerospace Database, Chimica, Communication Abstracts, Compendex, INSPEC, Metadex, Civil Engineering Abstracts
  • Anahtar Kelimeler: Electrolysis, Electroless coating, Copper, Silver, Hot-pressing, MECHANICAL-PROPERTIES, OXIDATION RESISTANCE, COMPOSITES, DEPOSITION, MORPHOLOGY, PARTICLES
  • Karadeniz Teknik Üniversitesi Adresli: Evet

Özet

© 2022In this study, electrolytic copper powders (ECs) were fabricated by electrolysis method using scrap copper pieces as the main material. Copper-silver bimetallic powders (ESCs) were obtained by electroless silver coating process. Then, copper-silver layered materials (ESC materials) with different process parameters were fabricated by using the hot-pressing method. The effects of hot-pressing temperature (25, 200, 400, 500 and 550 °C) and pressures (400, 500 and 600 MPa) on the properties of ESC materials were investigated. Morpholological examination of ECs and ESCs and microstructure examination of layered copper-silver materials was performed using scanning electron microscopy (SEM). Electrical and thermal conductivity, hardness and density of the materials produced with different hot-pressing parameters were examined. According to the results, it was determined that materials with the best physical and mechanical properties were obtained when the temperature used in hot- pressing was 500 °C and the pressure was 600 MPa. In materials produced at higher temperatures and pressures, a decrease in electrical and thermal conductivity values was determined as a result of the increase in deformation.