Numerical modeling of cold powder compaction using multi particle and continuum media approaches


POWDER TECHNOLOGY, vol.271, pp.238-247, 2015 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 271
  • Publication Date: 2015
  • Doi Number: 10.1016/j.powtec.2014.11.008
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Page Numbers: pp.238-247
  • Keywords: Multiparticle FEA, Continuum approach, Powder compaction, Material models, Friction, IRON-ORE PELLETS, DENSIFICATION BEHAVIOR, LARGE-DEFORMATION, YIELD FUNCTION, DISCRETE, METAL, SIMULATION, COMPRESSION
  • Karadeniz Technical University Affiliated: Yes


Numerical analysis of powder compaction process requires multi-particle modeling approach as continuum models fail to simulate the nature of process (e.g. interparticle, and particle-die interactions), accurately. This study aimed for analyzing powder compaction process utilizing 3-D finite element modeling approach along with different material models including modified Cam-Clay, Mohr-Coulomb, Shima-Oyane and von-Mises. The finite element analyses were carried out by implementing multi-particle finite element method. Moreover, continuum modeling was also performed for comparison purposes. In both cases, the compaction of spherical copper particles was analyzed at room temperature conditions. The obtained FEA results were compared in terms of equivalent stress and strain, and deformed shape. Results showed that the FE models in which von-Mises and modified Cam-clay material models were used yielded results of similar magnitude while those of Shima-Oyane and Mohr-Coulomb material models resulted in equivalent stress and strain values are in close proximity. Effect of coefficient of friction on the results was also investigated by implementing three distinct coefficients of friction (mu = 0.1, 0.25, 0.4). It was noted that increasing friction resulted in elevated level of deformation for the particles and harsher particle-particle, and particle-die contact interactions. (C) 2014 Elsevier B.V. All rights reserved.