Pythagorean fuzzy logic-based evaluation of factors affecting the bonding strength of wood and wood-based materials


SİNGER H., ÖZŞAHİN Ş.

Journal of Adhesion Science and Technology, cilt.39, sa.22, ss.3431-3455, 2025 (SCI-Expanded, Scopus) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 39 Sayı: 22
  • Basım Tarihi: 2025
  • Doi Numarası: 10.1080/01694243.2025.2555669
  • Dergi Adı: Journal of Adhesion Science and Technology
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Academic Search Premier, Aerospace Database, Chemical Abstracts Core, Chimica, Communication Abstracts, Compendex, INSPEC, Metadex, Civil Engineering Abstracts
  • Sayfa Sayıları: ss.3431-3455
  • Anahtar Kelimeler: adhesive performance, Pythagorean fuzzy logic, SWARA, Wood bonding
  • Karadeniz Teknik Üniversitesi Adresli: Evet

Özet

This study aims to identify, evaluate, and prioritize the key factors influencing the bonding strength of wood and wood-based materials using a Pythagorean fuzzy step-wise weight assessment ratio analysis (PF-SWARA). Within the model, 6 main groups and 30 subfactors are defined. PF-SWARA is applied to assess the significance of the factors. According to the results, the subfactors with the highest local importance are ‘wood species and density’ within the ‘material and surface properties’ group, ‘adhesive type and chemical composition’ within the ‘adhesive properties’ group, ‘surface cleaning and contaminant removal’ within the ‘surface preparation and activation procedures’ group, ‘pressing pressure and duration’ within the ‘application processes and parameters’ group, ‘temperature and humidity stability’ within the ‘curing conditions and environmental control’ group, and ‘surface wetting and adhesive spreadability’ within the ‘adhesion mechanisms and surface interactions’ group. The overall priority results demonstrate that the most important subfactors are ‘adhesive type and chemical composition’, ‘wood species and density’, ‘moisture content and hygroscopic equilibrium’, ‘curing mechanism’, and ‘surface wetting and adhesive spreadability’. The findings of this study offer valuable guidance for researchers, materials engineers, and manufacturers by highlighting the most impactful factors to control and optimize in bonding processes.