Applied Thermal Engineering, cilt.298, 2026 (SCI-Expanded, Scopus)
Overcoming heat management bottlenecks via surface engineering rather than internal additives, this study utilizes a Cu/Ag armor to transition heat transfer from slow phonon diffusion to ultrafast free-electron conduction, achieving unmatched thermal conductivity without sacrificing phase-change encapsulation. Expanded graphite (EG) matrices, encapsulated 93% paraffin wax (PW) by weight, were coated with a thick Cu shell (electrolytic) and then a thin Ag film (electroless). Results of characterization confirmed that the EG/PW@Cu@Ag composite developed by the experiment raised the thermal conductivity of pure PW from 0.21 W/m·K to a record 43 W/m·K, which indicated that, although the conductivities increased greatly, the latent storage of heat in the system (199.6 J/g) of material was maintained overcoming the trade-off problem. Due to the Ag layer the passivation of Cu surface occurred and demonstrated that the chemical structure is not changed even in 500 melt-freeze cycles with a negligible enthalpy loss at 3.6%. Infrared thermography confirmed the ultra-fast heat dissipation of the Cu-Ag armor, accelerating early-stage heat spreading (from 42.4 °C to 51.1 °C at 60 s) while ultimately capping the peak surface temperature at 70.1 °C (120 s) to suppress localized overheating. Therefore, the composite developed in this work provides a competitive and environmentally friendly candidate for application in thermal control of electric vehicle battery pack and next-generation high-power electronic systems due to its high energy density and best heat transfer rate.