The Shielding Parameters of the Superconducting Tin Based Solders

Aksoy C.

El-Cezeri Journal of Science and Engineering, vol.8, no.3, pp.1529-1535, 2021 (Scopus) identifier identifier


In the current study shielding parameters, the mass and linear attenuation coefficients, and Half Value Layer (HVL), Tenth Value Layer (TVL) and Mean Free Path (MFP) values were calculated theoretically used the calculation software Phy-X/PSD for superconducting lead free SnIn alloy solder system that the alloy composition were chosen from the binary phase diagram of SnIn and PbSn which has been mostly used solder alloy for in micro electric and cryogenic applications for decades. The results showed that among the studied sample increasing tin content decreases the shielding efficiency and Sn20In80 system shows better shielding properties depend on the used energy. Thus, it needs to be considered the energy range to determine the thickness of the material subjected to the gamma radiation as the shielding parameters change depend on using energy