Roughness analysis of CVD Cu films on different substrates by AFM imaging


Alver U.

JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, vol.11, no.6, pp.622-624, 2002 (Journal Indexed in SCI) identifier identifier

  • Publication Type: Article / Article
  • Volume: 11 Issue: 6
  • Publication Date: 2002
  • Doi Number: 10.1361/105994902770343601
  • Title of Journal : JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
  • Page Numbers: pp.622-624

Abstract

The roughness analysis of chemical vapor deposition (CVD) of copper (Cu) thin films on various substrates with and without seed layers was studied using atomic force microscopy (AFM). The effect of the seed layers on the film morphology was investigated, and none of the seed layers on the substrates improved the film morphology compared with TiN.