Roughness analysis of CVD Cu films on different substrates by AFM imaging

---

Atıf İçin Kopyala

Alver U.

JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, cilt.11, sa.6, ss.622-624, 2002 (SCI-Expanded)

• Yayın Türü: Makale / Tam Makale
• Cilt numarası: 11 Sayı: 6
• Basım Tarihi: 2002
• Doi Numarası: 10.1361/105994902770343601
• Dergi Adı: JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
• Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus
• Sayfa Sayıları: ss.622-624
• Karadeniz Teknik Üniversitesi Adresli: Hayır

Özet

The roughness analysis of chemical vapor deposition (CVD) of copper (Cu) thin films on various substrates with and without seed layers was studied using atomic force microscopy (AFM). The effect of the seed layers on the film morphology was investigated, and none of the seed layers on the substrates improved the film morphology compared with TiN.