Roughness analysis of CVD Cu films on different substrates by AFM imaging

Alver U.

JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, vol.11, no.6, pp.622-624, 2002 (SCI-Expanded) identifier identifier


The roughness analysis of chemical vapor deposition (CVD) of copper (Cu) thin films on various substrates with and without seed layers was studied using atomic force microscopy (AFM). The effect of the seed layers on the film morphology was investigated, and none of the seed layers on the substrates improved the film morphology compared with TiN.